System Automation

HMI has the ability to turn your stand-alone printer into a fully automated system using our substrate handling line of products. Whether your system requires the integration of HMI manufactured processing equipment, such as an HMI IR Dryer, or other processing equipment, such as a furnace supplied by another manufacturer, HMI can provide the handling products to move a blank substrate through the system until it becomes a completed assembly.

The capability to integrate substrate handling into your system doesn’t always end with the print line. HMI load and unload equipment can be used move parts though post-print inspection and modification equipment, such as an AOI processor or a laser trimming machine.

Our range of customizable handling systems are ideal for a range of industries, including hybrid circuitry, co-fired ceramic, solar cells and multi-layer thick film. The HMI system handling line is divided into several categories.

  • Partitioned cassette handling. Printed substrates can be individually placed in a partitioned magazine, which is easy to handle and move from assembly point to assembly point.
  • Stack magazine handling. A convenient way to load blank substrates into the process by simply loading them straight from the box into our customized magazine.
  • Substrate transport. Whether it’s a robotic servo mechanical assembly or a simple conveyor system, HMI provides a method to get your substrate where it needs to go.

If you require a new printing system or if you are retrofitting your existing HMI or AMI-Presco system to include automation, we offer a broad range of modular substrate handling equipment that functions in tandem with your screen printer, dryer, furnace or other pre- and post-print processing equipment.

Partitioned Cassette

HMI offers a partitioned cassette system to handle pre- and post-print substrates. We also provide equipment to load and unload the magazines that cycle either two, three or five magazines at a time to prevent system stoppage and provide opportunity for the operator to change out magazines.

The magazine, itself, is a styrene-molded assembly that is custom designed to fit a specific substrate. Each magazine provides an individually partitioned cell where the substrate can be loaded. Only the bottom outer edge and sides of the substrate come into contact with the magazine assembly, making this method of handling ideal for printed parts that have not been fired or cured.

A variety of handling methods can be fitted to the load and unload equipment to minimize substrate contact, thus avoiding print damage, contamination and breakage. Designed principally for rigid substrates and wafers, the HMI Partitioned Magazine Load/Unload line of products is an efficient and effective way to integrate various assembly equipment, loop product through the system and to store or transport substrates at various points in the assembly process.

Stack Magazine

The HMI stack cassette system is recommended to handle substrates that allow contact between substrate surfaces without affecting the performance of the final assembly. A loader or unloader handles the magazines in either a two, three or five magazine configuration. This helps to prevent system stoppage and to provide an opportunity for the operator to refill the magazines.

The magazine itself is an unobstructed aluminum enclosure assembly that is custom designed to fit a specific substrate. Each magazine allows the operator to load the substrates directly from the packaging stack as shipped by the substrate supplier. The substrates come into contact with one another top and bottom, and are advanced into the load position driven bottom to top. Minimal movement and vibration helps to prevent damage, contamination and breakage. The unload process is simply the reverse of the loading operation, as the substrates are indexed into the magazine top and lowered down.

Designed principally for rigid substrates and wafers, the HMI Stack Magazine Load/Unload line of products is an efficient and effective way to integrate various assembly equipment, loop product through the system, and to store or transport substrates at various points in the assembly process. Available with several custom-designed methods of handling the substrate, the Stack Magazine system can be combined with other HMI handling methods to maximize system throughput and minimize operator interaction.

Substrate Transport Conveyor

HMI offers several conveyor methods of transporting substrates. Some methods, such as the edge rail conveyor, can incorporate into the load and unload system equipment of our magazine systems. Some conveyor systems, such as our collocator belt conveyor, are designed to stand alone or function in concert with the printer. HMI is capable of integrating these conveying methods into existing systems in the field or into equipment manufactured by other suppliers that make complementary equipment.

Conveyor systems can be used to move substrates into, and out of, a magazine or buffer. They can be used to unload toolplates, position a part for inspection, and transport a substrate from one piece of processing equipment to another. Our collocating belts can be used to group substrates into a line for loading onto a dryer or a furnace belt, helping to maximize the unit’s capacity.

The Conveyor Transport line of products at HMI can be custom engineered to meet your system and automation needs and is easily integrated into our HMI Screen Printer, IR Dryer and Load/Unload equipment lines.

Substrate Transport Servo Robotic

To accommodate the various types of processing systems associated with screen printing, HMI has develop the ability to transport substrates using servo robotic technology. While the majority of the applications involve simple linear (X) transport, the system can also incorporate transverse (Y) movement, rotation (T) and can even flip a substrate front to back.

HMI’s servo robotic capabilities can be extended to our line of magazine loaders. It can be integrated with the HMI screen printer and IR dryer product lines. The HMI robotic transport system can even be used to accommodate processing equipment provided by other suppliers.

A variety of custom-engineered substrate handling mechanisms can be employed to ensure that your substrate is transported with the appropriate consideration for print integrity, contamination and substrate damage. Developed to meet the challenges of LTCC and wafer fabrication, HMI’s servo robotic transportation system was designed with adaptation to process demands in mind.

The HMI Servo Robotic Substrate Transport system is a versatile and dependable way to move your assembly from one process step to another. Custom designed and available for factory or field installation, the Servo Robotic Transport system can be fully integrated into any automated production line.